Nvidia CEO Jensen Huang Addresses TSMC Packaging and Industry Demands

Jensen Huang, Nvidia's CEO, has been open about the company's reliance on Taiwan Semiconductor Manufacturing Company (TSMC) for chip packaging.

TSMC is the world's largest independent semiconductor foundry, accounting for over 50% of the global market share.

Huang has acknowledged the industry's growing demand for more advanced packaging technologies to meet the increasing complexity of modern chips.

Nvidia's demand for advanced packaging from TSMC remains strong, but the kind of technology it needs is changing.

Jensen Huang, Nvidia's CEO, mentioned that the company will use largely CoWoS-L for its Blackwell chips, which is a newer type of technology.

Nvidia has been relying mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips, but will transition its CoWoS-S capacity to CoWoS-L.

The amount of advanced packaging capacity available is "probably four times" what it was less than two years ago, according to Huang.

This increase in capacity is not about reducing capacity, but rather increasing capacity into CoWoS-L.

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Nvidia has been selling its Blackwell chips as quickly as TSMC can make them, but packaging has remained a bottleneck due to capacity constraints.

Huang's comments suggest that Nvidia is pivoting towards a newer technology, CoWoS-L, which may impact its suppliers.

Reports from Taiwanese media suggest that Nvidia is reducing its CoWoS-S orders from TSMC, potentially affecting the revenue of the Taiwanese chip manufacturer.

Nvidia's shift to CoWoS-L may help alleviate capacity constraints, but it's unclear how this will affect the company's suppliers in the long run.

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Nvidia CEO Jensen Huang has confirmed that the company's demand for advanced packaging from TSMC remains strong.

Huang stated that Nvidia's most advanced AI chip, Blackwell, will use CoWoS-L technology, a newer type of chip on wafer on substrate technology.

Nvidia is still manufacturing Hopper, which will use CoWoS-S technology, and will transition the CoWoS-S capacity to CoWoS-L.

The company's advanced packaging capacity is increasing, with Huang noting that it's "probably four times" the amount available less than two years ago.

Nvidia has been selling its Blackwell chips as quickly as TSMC can make them, but packaging has remained a bottleneck due to capacity constraints.

Huang emphasized that the increasing capacity is not about reducing capacity, but rather increasing it into CoWoS-L.

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Nvidia's CEO Jensen Huang says demands for advanced packaging technology are evolving. Nvidia's most advanced AI chip, Blackwell, requires a complex chip on wafer on substrate (CoWoS) advanced packaging technology.

Nvidia's demand for advanced packaging from TSMC remains strong, but the kind of technology it needs is changing. The company is shifting its focus to a newer type of technology, CoWoS-L.

Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips. The company is transitioning its CoWoS-S capacity to CoWoS-L.

The amount of advanced packaging capacity available is "probably four times" what it was less than two years ago. This is despite packaging being a bottleneck due to capacity constraints.

Nvidia has been selling its Blackwell chips as quickly as TSMC can make them, but packaging has remained a limiting factor. The company is increasing capacity into CoWoS-L, not reducing it.

Reports from Taiwanese media suggest that Nvidia is reducing its CoWoS-S orders from TSMC, potentially affecting the revenue of the Taiwanese chip manufacturer.

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